Removal of resins such as epoxy and silicone adhered to semiconductor packaging molds.
Playing a role in quality control of semiconductor packaging! Removing only dirt without damaging the mold!
A cleaning machine called "Hagitori" that can clean and remove thermosetting resins (such as epoxy, silicone, and urethane) adhered to essential encapsulation molds in semiconductor manufacturing without damaging the molds, and can wash and remove multiple pieces at once. - Significantly reduces cleaning time - Reduces maintenance frequency - Lowers maintenance costs This can also lead to improved productivity.
- Company：ソマックス
- Price：Other
